１、LIGHTING 　 1、PCB Layout ■　Traces (differential) impedance ■　Design for Low EMI 2、DC - DC Design ■　DC - DC PWM IC　 ■　Mini Size And High Frequency SMD CHOKE 3、EMI Debug ■　Fiter core characteristic analysis ■　R/L/C reduce high frequency noise ■　Insulation and shield application ２、DSC 　 PCB ASSY PROCESS (ACF、HOT - BAR、COB) Process   SMT : Double side, Pin in paste, Under fill,       Side fill, Ball assembly   PTH   Laser Trimming   ACF Heat Seal   Hot-Bar Solder Joint   Hybrid : Technology of IC package and PCB assembly Integration SMT plus die attach and wire bonding Module plus ball assembly (component level) 　COB Component 　BGA(1024 balls), uBGA, Flip Chip, CSP, QFP (0.4mm Pitch) 　Smallest chip size: 0201 ３、LCD MONITOR 　 Each of our technical catalogs will be available in the Adobe Acrobat PDF format suitable for downloading across the Internet.